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Hi-Cut Buff(FHC/CHC)
Application: ·Remove permanent hole plugging ink(Hi-Cut Buff) ·Leveing build-up resin/prepreg resin after IVH/BVH(Hi-Cut Buff) ·Reduce copper thickness/remove residual copper dust after plating (Hi-Cut Buff) ·Remove PP resin on SUS laminate ·Pre-treatment of photo resist(DF)/solder mask(SM)/solder resist(WF) processes ·Clean/Grind SUS board ·Clean/Deoxide/Scrub/Finish thin copper board ·Polish copper/brass/steel sheet/coil
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