Hi-Cut Buff(FHC/CHC)
Application:
·Remove permanent hole plugging ink(Hi-Cut Buff)
·Leveing build-up resin/prepreg resin after IVH/BVH(Hi-Cut Buff)
·Reduce copper thickness/remove residual copper dust after plating (Hi-Cut Buff)
·Remove PP resin on SUS laminate
·Pre-treatment of photo resist(DF)/solder mask(SM)/solder resist(WF) processes
·Clean/Grind SUS board
·Clean/Deoxide/Scrub/Finish thin copper board
·Polish copper/brass/steel sheet/coil
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