Hi-Cut Buff(FHC/CHC)

Application:
·Remove permanent hole plugging ink(Hi-Cut Buff)
·Leveing build-up resin/prepreg resin after IVH/BVH(Hi-Cut Buff)
·Reduce copper thickness/remove residual copper dust after plating (Hi-Cut Buff)
·Remove PP resin on SUS laminate
·Pre-treatment of photo resist(DF)/solder mask(SM)/solder resist(WF) processes
·Clean/Grind SUS board
·Clean/Deoxide/Scrub/Finish thin copper board
·Polish copper/brass/steel sheet/coil

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Product serial number

Category

Hi-Cut Buff(FHC/CHC)

Quantity

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Stock:

0

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1

Product Description

Base Materials：
·Non-Woven abrasive
·XI pipe ·SUS， Aluminium pipe ·GSH Know-how adhesive

Features：
·High/Middle cutting force

·Uniform surface roughness

·Good panel appearance

·Good flexibility

Technical parameters:

Grit	320#	400#	600#	800#	1000#
Abrasive	SIC/AO
O D	3%/4/ 4.5/5/5.5/ 6/ 8/ 10/ 12/ 14 （inch）
I D	25.4mm、32mm、50.8mm、76.2mm、100mm、150mm、190mm
L	450mm、550mm、610mm、650mm、670mm、710mm、1200mm、1350mm
Hardness	（Soft）A1、A2、A3		(Hard)B1、B2、B3		(very Hard) C1、C2、C3