Matched Plugging Ink
This introduction is applicable in plugging in PCB via holes for
GSH Matched Plugging Ink used, blind holes and buried holes,
which supplied by GSH to end user.
Product Slices Picture
*Suggestion:
1. Chemical remove ink rate: 0.25-0.50mg/cm2
2. PTH Copper thickness≥15um
Specifications
Physical |
Unit / Condition |
GSH-00200 |
GSH-00400 |
GSH-00500 |
Remarks |
|
Viscosity |
Pa.s/25 ℃ |
800±100 |
700±100 |
700±100 |
NDJ-8S |
|
Storage Life |
≤5℃ |
3 Months |
6 Months |
6 Months |
||
Shelf Life |
20 ℃ |
7 Days |
7 Days |
7 Days |
||
Water Absorption |
JIS C6481 |
% |
0.21 |
0.18 |
0.15 |
|
Solids |
% |
100 |
100 |
100 |
||
Pencil hardness |
JIS K-5400 |
> 6H |
7H |
8H |
8H |
|
Glass Transition Temperature |
℃ |
132.5 |
171.1 |
161.3 |
TMA |
|
Coefficient of Thermal Expansion |
β1 |
ppm/°C |
42.7 |
33.4 |
41.5 |
TMA |
β2 |
ppm/°C |
126.5 |
104.0 |
134.2 |
TMA |
|
Young's Modulus |
30°C | MPa | 6840 | 6900 | 6950 | DMA |
100°C | MPa | 1700 | 5550 | 5230 | ||
150°C | MPa | 390 | 3810 | 3050 | ||
200°C | MPa | 300 | 1670 | 1470 | ||
250°C | MPa | 320 | 1170 | 1000 | ||
Dielectric Constant |
ASTM D150 |
1MHz |
5.18 |
5.22 |
5.04 |
|
Dielectric Dissipation Factor |
ASTM D150 |
1MHz |
0.0268 |
0.0339 |
0.0363 |
|
Scrubbing condition |
GSH Machine |
3 passes |
OK |
OK |
OK |
|
Curing |
℃×min |
80×30+110×30+150×60 |
80×30+110×60+150×60 |
80×30+110×60150×30 |
||
Heat Impact Test |
Float |
288 ℃×10S×3 time,no bubble |
OK |
OK |
OK |
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