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Ceramic Brush
·Remove permanent hole plugging ink
·Leveling build-up resin/prepreg resin after IVH/BVH process
·Reduce copper thickness/residual copper dust after plating
·Remove oxided layer
·Deburr after drilling
·Remove PP resin on SUS laminate
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Number of views:
1000
Product serial number
Category
Ceramic Brush
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Product Description
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Base Materials： ·Ceramic Cubic·XI pipe·Rbber pipe·Sponge Features： ·Cutting force:High/middle/low cutting force
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Technical parameters：
| Grit | 320 # | 400 # | 600# | 800# | 1000# | 1200# | 1500# | 2000# | 2500# |
| Abrasive | SIC/AO | ||||||||
| Size | OD162/150/140/127/70*ID76.2/50.8/25.4*L120/610/710/1100mm | ||||||||
| Ceramic Cubic | L*W*H=8*8*12mm，9*9*12mm，11*11*8mm，11*11*9mm，11*11*12mm，13*13*12mm | ||||||||
Example:
| Application | Remove plugged ink/reduce copper/remove copper dust after electro-plating | |||
| Brush Combination | GSH CRBA600#*6+GSH CRBB800#*2 | |||
| Machines | (GSH)MAB4G | (GSH）MAB4N | (GSH)MAB4A | |
| Conditions | 1.5A, 2.5m/min | |||
| Features | ·No damage to holes ·No impress to tinn PCB(T<0.3mm) ·Uniformly cutting | |||
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